Gold Coated Si Wafer

Nano-Tec gold coated silicon wafers

Introduction

The Nano-Tec gold coated silicon wafers are useful for thin film research, AFM / SPM, nanotechnology and biotechnology applications. The silicon wafers are coated with 50nm of pure gold over a 5nm adhesion layer of Ti. Both Ti and Au are deposited in a dedicated high vacuum deposition system with electron beam evaporation sources. The gold coating is not atomically flat; there are height differences in the nm range. The maximum use temperature is around 175°C; higher temperatures could result in delamination of the gold film. The Nano-Tec gold coated wafers are dividually packed in 2''wafer carrier trays for protection.

Specifications of the Nano-Tec gold coated Ø2”/51mm silicon wafers:

Coating film	50nm Au, 99.999% purity
Adhesion film	5nm Ti, 99.98% purity
Surface roughness	several nm
Si substrate Orientation	<100>
Type	P (Boron) with one primary flat
Resisantance	1-30 Ohm/cm
Thickness	275µm (+/- 20µm)
Diameter	51mm
TTV	=< 20µm
Primary Flat	15.9 +/- 1.65mm