Gold Coated Si Wafer
Nano-Tec gold coated silicon wafers
Introduction
The Nano-Tec gold coated silicon wafers are useful for thin film research, AFM / SPM, nanotechnology and biotechnology applications. The silicon wafers are coated with 50nm of pure gold over a 5nm adhesion layer of Ti. Both Ti and Au are deposited in a dedicated high vacuum deposition system with electron beam evaporation sources. The gold coating is not atomically flat; there are height differences in the nm range. The maximum use temperature is around 175°C; higher temperatures could result in delamination of the gold film. The Nano-Tec gold coated wafers are dividually packed in 2''wafer carrier trays for protection.
Specifications of the Nano-Tec gold coated Ø2”/51mm silicon wafers:
| Coating film | 50nm Au, 99.999% purity |
| Adhesion film | 5nm Ti, 99.98% purity |
| Surface roughness | several nm |
| Si substrate Orientation | <100> |
| Type | P (Boron) with one primary flat |
| Resisantance | 1-30 Ohm/cm |
| Thickness | 275µm (+/- 20µm) |
| Diameter | 51mm |
| TTV | =< 20µm |
| Primary Flat | 15.9 +/- 1.65mm |
